Smart Stress Investigator (SSI™)

General Description

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SSI  is a micro-destructive  system able to monitor real-time stress conditions within existing post-tensioned structures.


Featuresslit Smart Stress Investigator (SSI™)

Long term evaluation of transient stress conditionsslit Smart Stress Investigator (SSI™)

  • Preserves referenced instrument location
  • Presents a user-friendly controller interface
  • Self-calibrating

Technical Description

  • SSI exploits a Digital Image Analysis (DIA) approach based on stress release phenomena
  • A suspect structural surface is randomly paint-sprayed
  • SSI captures an image of this pre-stress-released condition: C1
  • The mid-line of the zone under test is cut to a depth of one inch to release existing stress
  • SSI captures an image of the post-stress-released condition: C2
  • Advanced Digital Image Analysis protocol compares C2 to C1  and, by  strain-to-stress conversion, quantifies existing post-tension beam stress.



  • Resolution: 4800 dpi
  • Accuracy: 1 micron
  • Measureable range : 18 in x 18 in
  • Power supply 120 VAC +/- 10% (60Hz +/-5%)
  • Temperature: from -40 to 160 F
  • Dimension 25 x 25 x 2 inches
  • Weight: 6 lbs


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